3M™ Thermal Interface Pads

3M Thermally Conductive Interface Pads are soft, conformable thermal interface pads with high thermal conductivity and dielectric strength. They can be die cut to fit individual applications, makin

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  • Good softness and conformability to non-flat surfaces.
  • Excellent compressive stress relaxation.
  • High thermal conductivity.
  • UL94 V-O certified (File No. E176845).
  • Good surface tack leads to low thermal resistance at surface.
  • Non-silicone acrylic elastomer.
  • Good dielectric performance.
  • Excellent durability for long term thermal conductivity and electric insulation stability
  • High thermal conductivity, 2.0W/m-K on plane direction
  • Good softness and conformability even to non-flat IC surfaces and heat spreading blocks
  • Passes UL 94 V-0 flame retardancy test
  • No siloxane outgassing or oil bleeding
  • Soft compliant material allows for pressure relaxation, preventing high pressure zones on components
  • Good electrical insulation properties
  • Slight tack allows easy pre-assembly
  • Good wetting performance for better thermal conductivity

How You Can Use :

  • IC packaging heat conduction
  • Heat sink interface
  • COF chip heat conduction
  • LED board TIM
  • HD TV address IC chip and scan module board
  • General gap filling in electronic device
  • Mechanical fastening such as clamp, bracket, and screw can be used in parallel with this thermal conductive tape

SRP Is A Preferred Converter Of 3M™ Thermal Interface Pads