GAP PADS: Greater Conformability, thermal Performance and easier Application
GAP PADS provide effective thermal interfaces between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interface resistance. As well as providing low stress vibration damping and are compatible with automated dispensing equipment.
BERGQUIST GAP PAD TGP 1500, Thermally Conductive, Un-Reinforced, Silicone Based Pad
BERGQUIST® GAP PAD TGP 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.
FEATURES AND BENEFITS
- Thermal conductivity: 1.5 W/m-K
- Un-reinforced construction for additional compliancy
- Conformable, low hardness
- Electrically isolating
BERGQUIST GAP PAD TGP 1000VOUS, Ultra Conformable,Thermally Conductive Material for Filling Air Gaps
BERGQUIST GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics.
FEATURES AND BENEFITS
- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
- Decreased strain
- Puncture, shear and tear resistant
- Electrically isolating
BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable,Thermally Conductive Material for Filling Air Gaps
Electrically isolating BERGQUIST GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUSB is an electrically isolating material, which allows its use in applications requiring isolation between eat sinks and high-voltage, bare-leaded devices.
FEATURES AND BENEFITS
- Thermal Conductivity: 1.0 W/m-K
- Highly Conformable, low hardness
- “Gel-like” modulus
- Decreased strain
- Puncture, shear and tear resistant
- Electrically isolating
BERGQUIST GAP PAD TGP 800VO Conformable, Thermally Conductive Material for Filling Air Gaps
BERGQUIST GAP PAD TGP 800VO is a cost-effective, thermally conductive interface material. The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling. The conformable nature of BERGQUIST GAP PAD TGP 800VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.
FEATURES AND BENEFITS
- Thermal Conductivity: 0.8 W/m-K
- Enhanced puncture, shear and tear resistance
- Conformable gap filling material
- Electrically isolating
BERGQUIST SIL PAD TSP 900, The Original Fiberglass-reinforced, Silicone Based Insulator
BERGQUIST® SIL PAD TSP 900 is a composite of silicone rubber and fiberglass. The material is flame retardant and is specially formulated for use as a thermally conductive insulator. The primary use for The Original Sil-Pad® Material is to electrically isolate power sources from heat sinks. BERGQUIST SIL PAD TSP 900 material has excellent mechanical and physical characteristics. Surfaces are pliable and allow complete surface contact with excellent heat dissipation. BERGQUIST SIL PAD TSP 900 actually improves its thermal resistance with age. The reinforcing fiberglass provides excellent cut-through resistance. In addition, BERGQUIST SIL PAD TSP 900 is non-toxic and resists damage from cleaning agents.
FEATURES AND BENEFITS
- Thermal impedance: 1.13°C-in2/W (@50 psi)
- Original Sil-Pad material
- Excellent mechanical and physical characteristics
- Flame retardant