Thermal Gap Pads

Thermal Gap Pads are used for managing heat within electronic assemblies. Thermal Gap Pads adhere and conform to fill the space between a heat source and a heat sink in order to efficiently cool in

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  • Provides safety by eliminating the possibility of an electrical fire
  • Provides longevity to finished electronic products by keeping the internal components from wear and tear due to high temperatures cause by the circuit board
  • Provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present
  • Elimination of air gaps to reduce thermal resistance
  • High conformability to reduce interfacial resistance
  • Low-stress vibration dampening
  • Compatible with automated dispensing equipment

How You Can Use Thermal Gap Pads:

  • Between heat-generating semiconductors or magnetic components and a heat sink
  • Telecommunications
  • Computers
  • Power conversion
  • Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
  • 3M Thermal Interface Tapes

  • 3M Thermal Interface Pads

  • Bergquist Gap Pad®

  • Bergquist Sil-Pad®

SRP Is A Preferred Converter For The Following Manufacturers: